Map / Chip factories and packaging
GlobalFoundries GFS
US contract chipmaker; signed a $2B deal to make silicon interposers for TSMC's packaging, ramping in 2028.
Depends on
No sourced links yet.
Supplies
- TSMC: Silicon interposers for CoWoS. $2B deal, initial five-year term, made in Malta, New York; production ramps in the first half of 2028. Manufacturing Dive, 2026-10-08
Data as of 2026-11-02. Cite as: Ye, Mike. "GlobalFoundries" (globalfoundries). AI Lattice, dataset v0.5.0. https://ailattice.ai/e/globalfoundries/. How to cite.